New Teledyne FLIR development kits streamline integration
James Thorpe
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Teledyne FLIR has confirmed the release of its development kits for quick integration of the FLIR Hadron 640R thermal and visible dual camera module.
The hardware and reference software drivers are designed to work with development boards that support the NVIDIA Jetson Nano, the Qualcomm RB5 and the Qualcomm Snapdragon 865.
The Hadron 640R features a compact 640×512 resolution radiometric Boson thermal camera module, providing the ability to see through total darkness, smoke, most fog and glare, capturing the temperature of every pixel in the scene.
The Boson is paired with a 64MP visible electro-optical (EO) camera for high definition visible imagery. The company explained that the development kits enable integrators to start imaging and controlling the cameras within hours.
This helps significantly reduce development time and costs further making it the ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms and AI-ready applications where efficient battery run-time and battery life are mission-critical.
Michael Walters, Vice President, Product Management, Teledyne FLIR said: “The powerful Hadron 640R development kits provide integrators industry-leading thermal and visible camera operation using both Linux and Android application development.
“Combined with the size, weight and power-optimised Hadron 640R and the Teledyne FLIR technical services team to support integration, these development kits further maximise efficiency for developers at every stage.”
